On July 12, Haesung DS held a groundbreaking ceremony to expand its
production plant for lead frames and packaging substrates, which are core
semiconductor components, at its Changwon plant.
In March, Haesung DS signed an investment agreement of about 350
billion won with Gyeongsangnam-do and Changwon Special City, and plans to
expand its production base, including high-tech facilities, with the aim of
mass-producing in the second half of 2024.
Haesung DS's main products, lead frames and packaging substrates, are
essential parts for making semiconductor substrates, and they connect
semiconductor chips and main substrates to deliver electrical signals and power
and support chips. In particular, Haesung DS has established a solid position
in memory package substrates, including automotive semiconductors, with its own
technology and manufacturing method, and has achieved the third-largest market
share in the global lead frame market in 2021.
Through this investment, Haesung DS said it will actively respond to the growing demand for automotive semiconductors such as electric vehicles and self-driving cars, strengthen the competitiveness of fast-growing memory package substrates, and also hire more than 300 local talent to create jobs.