Haesung DS, the specialist of package substrate for semiconductor, announced its successful development of the Super-Fine pitch Stamped QFP (Quad Flat Package) tools featuring an inner lead pitch (*ILP) 110㎛, surpassing the current industry standard of ILP 130㎛.

This latest innovation has been recognized as a significant technological advancement in the Fine Pitch QFP sector. It is expected to bolster Haesung DS’s competitive edge and facilitate its entry into new markets.

The ongoing trend in the semiconductor industry toward higher integration and enhanced performance has heightened the importance of lead frame precision and quality. In this context, ILP plays a pivotal role, as narrower pitches allow for a greater number of leads within a single package, enabling enhanced chip functionality and higher integration density. Furthermore, the reduction in lead spacing facilitates the miniaturization of packages, meeting the growing demand for portable and space-efficient solutions across various applications.

Through its dedicated efforts to address these industry demands, Haesung DS successfully developed the Super Fine Pitch QFP tooling, laying the groundwork for its strategic entry into the Fine Pitch QFP market.

Haesung DS highlighted that the technological achievement marks as breakthrough in responding to the rising global demand for fine pitch technologies, particularly in key market such as Japan.

“This ILP 110㎛ super-fine pitch technology represents a core innovation for accessing new markets.” A representative of Haesung DS remarked, “We are committed to expanding our product supply to global customers , enhancing our comptetitiveness in high-value markets, and leading the future of semiconductor package solutions.”