Package Substrate

Package substrate is the widely used substrate that connects semiconductor memory chips and external circuits board.
COB is a major component of SIM cards, credit cards and electronic passport.

Applications

Flash Memory

Mobile DRAM

Graphic DRAM

3Layer FBGA for Mobile DRAM

2Layer FBGA for Flash Memory

4/6Layer FBGA for Graphic DRAM

FcFBGA for DDR3/DDR4

Mobile SIM

Passport SIM

Credit Card Chip

Catridge Chip

8COB

6COB