ABOUT US

Overview

 
OUTLINE

Since its founding, Haesung DS has been at the forefront
of advancing the global semiconductor market.

After joining the Haesung Group in 2014, the company has focused on enhancing the value of its existing businesses
while pioneering future industries through the development of new technologies, such as graphene.

About Haesung DS

  • Company NameHaesung DS Co., Ltd.
  • EstablishedMarch 2014
  • ListedJune 2016 (KOSPI)

Revenue Composition* As of 2023

  • Exports

    Exports

    0%

  • PKG Substrate,Lead Frame

    PKG Substrate

    0%

    Lead Frame

    0%

Management Overview* Consolidated figures for 2023 (Unit: million KRW)

  • Total Assets

    Total Assets

    0

  • Total Equity

    Total Equity

    0

  • Revenue

    Revenue

    0

Business Areas

Lead Frame

Providing optimized lead frame solutions for automotive, mobile, and PC applications.

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PCB Substrate

A core component that electrically connects memory chips and the mainboard, serving as a substrate for mounting memory semiconductor chips.

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Tape Substrate

A key component for smart cards, applicable to SIM cards, credit cards, e-passports, and more.

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Graphene

A material with limitless scalability, offering exceptional processability, and industrial applicability.

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