Events
HAESUNG DS Participated in NH THE C FORUM
On May 22nd, HAESUNG DS participated in the “NH THE C FORUM” at the invitation of NH Investment & Securities.
Hosted by NH Investment & Securities, the event was organized to invite C-level executives fr|om companies with strong growth potential and provide institutional investors with opportunities to share long-term visions, discuss industry outlooks and strengthen the networking.
The forum was held over two days fr|om May 21st to 22nd, 2026, bringing together HAESUNG DS and various promising companies for meaningful discussions and exchanges.
Five representatives fr|om HAESUNG DS attend on the event on May 22nd, including the CEO, CFO, Head of Business Planning Team.
During the sessions, the company shared insights on recent market trends and future business outlooks.
It was also a valuable opportunity to directly communicate with institutional investors who have shown interest in the company, explaining HASUNG DS’s vision and strategy while exchanging diverse perspective and opinions.
The meeting began with a 15-minute presentation covering company introduction, current management status, business strategies by segment, and shareholder return policies, followed by a Q&A session.
The management team personally addressed a wide range of investor questions, helping resolve market concerns and enabling discussions regarding the company’s strategic direction and future plans.
As C-level executives attended the forum directly, discussions extended beyond short-term earnings and focused more deeply on long-term growth potential and broader industry trends.
Through these interactions, HAESUNG DS was able to better understand market perspective and investor sentiment regarding the current business environment, while also reaffirming its future strategic direction.
The key Q&A topics discussed during the event are as follows.
1. How long will the strong demand trend since early 2026 expected to continue?
Since the beginning of the year, the lead frame business has maintained high utilization rates due to the consistent strong demand fr|om OSAT customers. This strong demand is believed to be driven by favorable end market conditions, including increasing demand for power semiconductor, along with geological risks such as the global conflict and tariff-related issues.
Considering the current order backlog through June, strong demand for lead frames is expected to continue through the first half of the year. The demand is also anticipated to remain strong in the second half of the year, supported by increased safety stock by major customers.
2. How is the company responding to margin pressure caused by rising raw material prices?
Recent increases in LME prices have impacted the company’s profitability, and operating margins in the first quarter of 2026 came in below market expectations. However, HAESUNG DS operates an “LME-linked pricing system” in the lead frame business, where changes in LME prices are reflected in price after a certain time lag. This helps mitigate part of the burden caused by rising raw material costs. In addition, the company plans to further expand the range of LME price reflection this year to minimize cost pressures beyond the existing pricing mechanism.
3. What are the expected affects of package substrate price changes?
Structurally, the package substrate industry has limited room for price increases. However, sharp rises in LME prices fr|om last year through early this year significantly increased supplier burdens. As a result, major customer agreed to unusual price increases, considering the improving memory semiconductor market conditions.
These price increases have been reflected since the second quarter of 2026, and the company expects improvements in both earnings and profitability on a QoQ basis. If current sales levels are maintained and new product approvals in the second half proceed as we planned, the package substrate business is also expected to achieve profitability improvements.
4. Competitors are improving margins through high value-added products. What is HAESUNG DS’s strategy for the package substrate business?
Unlike others, HAESUNG DS applies a “Reel to Reel” production method in its package substrate manufacturing process. Compared to conventional panel-based processes, the Reel-to-Reel method offers higher productivity and improved price competitiveness.
Competitors are currently facing capacity constraints while responding to growing demand for high value-added products, leading them to focus more on high-end products with higher ASPs. As a result, HAESUNG DS has been rapidly expanding its market share in the commodity DRAM market by leveraging its superior productivity.
5. What is the outlook for performance after the first quarter of 2026?
Strong demand for lead frames that began earlier this year, along with increasing demand for commodity DRAM since the second half of 2025, continues to remain solid.
If LME prices remain stabilized, profitability in the lead frame business is expected to improve compared to the first quarter of 2026. In the package substrate business as well, mass production of new DDR5 products is accelerating fr|om the second quarter, while price increase effects for major customers and higher shipment volumes in the second half are expected to contribute to improved performance.
However, external variables such as LME prices and exchange rates, as well as fluctuation of DDR4 demand, will continue to be closely monitored.
6. Are there any additional capacity expansion plans for each business segment this year?
Following the completion of the new plant expansion in 2025, no additional investment for lead frame capacity expansion has been finalized yet. However, we will respond promptly if further capacity expansion becomes necessary after continuous reviewing on market conditions and customer demand trends. Therefore, we regularly conduct weekly meetings with customers to closely monitor the market changes.
For the package substrate business, current utilization rates remine around 60~70%, leaving sufficient room to accommodate additional demand. Therefore, we believe that additional capacity expansion within 2026 is not necessary at this stage.
Through the forum, HAESUNG DS was able to communicate its strategy and vision to investors and stakeholders in a more direct and transparent manner.
At the same time, we gained the balanced insight into both market expectations and concerns through diverse questions and feedback, providing an opportunity to further refine its execution strategies.
Going forward, HAESUNG DS plans to continue strengthening trust with investors through proactive IR activities and ongoing communication with the market.
By flexibly responding to changing industry environments and technologies demand, the company aims to enhance business competitiveness, improve profitability, and create sustainable corporate value.
We sincerely appreciate your continued interest and support for HAESUNG DS.
Thank you.
2026.05.29