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Overview

Lead Frame

Lead Frame is the basic component that delivers
electric signal to external circuits and supports
the chip inside of semiconductor
package mechanically.

Lead Frame

Applications

Automotive
Mobile Device
Personal Computer
Consumer Electronics

Key Features

  • Provide highly reliable solutions for automotive, mobile, and CE
    • Strong lineup of *μ-PPF™ , nano-scale plating for effective heat & corrosion resistance
    • Differentiated rough morphology for better adhesion between plating & EMC
  • No gold PPF™ & Super wide strip (90x270, 100x300mm) for value innovation
  • Advanced fine pitch Dual Row QFN & Routable MLF for next generation Package
  • Fast & accurate automatic visual inspection

*μ-PPF™: Micro PPF : Thin Ni, Pd, Au, Alloy Pre Plated Frame

Product Line-up

Product line-up Plating Pin
(Count)
ILP
(um)
Raw
material
Thickness
(mm)
Cu-Ag PPF
Ag Plating Roughen Cu u-PPF TM Upgrade
u-PPF
No Gold
u-PPF
Au Flash
PPF
Roughen
PPF
Spot / Ring 1 or 2
sides
Ni/Pd/Ag-Pd Ni/Pd/Au-Ag Ni/Pd/Ag-Pd Ni/Pd/Au 1 or 2
sides
QFN Normal QFN 2~108 Min 200 C19400 0.100~0.254
1-Map/Block type QFN 2~108 Min 200 C70250 0.125~0.254
Dual row QFN 76~156 Min 180 C70250 0.125~0.203
QFP ~100Pin 32~80 - C70250,C19400 0.125~0.152
100Pin~ 100~256 Min 130 C70250,C19400 0.125~0.152
SO 2~84 - C19400,C15100
C70250,N94100
0.125~0.254
TSOP 48
54
86
C70250
N94100
0.125
TR TO-220,TO-92
TO-3PN,4L SIP,D-PAK
D2I2-PAK,TO-264,TO-126
Full Ni / Selective Ni / Full Ag / Selective Ag / Ag stripe on full Ni / NiNiP - - C19210
C14415
C15100
0.38/0.50
0.90/1.30
LED 1006,1515,2020,2323,2016,
2835,3030,3020,3014,3228,
3528,3623,3737,4014,5050,
6060,7020,7070
Ni + Full Ag - - - - - - C19400 0.152~0.305
Routable
MLF
Flip chip type Anti-Tarnish 29,32
60
Min 100 C19400
C70250
0.100~0.230
Wire bonding type 49100
136168

*Specifications are subject to change without notice

detail view