Haesung DS (195870, CEO Choi Young-sik), a subsidiary of Haesung Group and a leading manufacturer of semiconductor components, announced that it participated in the KPCA Show 2025, held from September 3 to 5 at Songdo Convensia in Incheon, where it showcased its advanced production technologies for core semiconductor substrates.

The KPCA Show (International PCB & Semiconductor Packaging Industry Exhibition) is the largest exhibition in Korea dedicated to PCB and semiconductor packaging. Haesung DS has participated annually since 2023, introducing new technologies to industry professionals. This year, the company highlighted its three core semiconductor substrate technologies.

At the exhibition, Haesung DS organized its booth into three zones: ▲Lead Frame Zone ▲Package Substrate Zone ▲Tape Substrate Zone. Each featured product samples and operational equipment videos, allowing visitors to easily grasp the unique characteristics of its offerings.

As one of the few global semiconductor component manufacturers capable of mass-producing and supplying all three core substrates—lead frames, package substrates, and tape substrates—, Haesung DS reported strong interest from booth visitors.

A company representative stated, “By leveraging our high productivity and stability, we continue to maintain strong partnerships with leading global clients. The positive reactions and interest we received at this exhibition reaffirm our competitiveness. Moving forward, we will continue to drive technological innovation and explore new growth markets.”