Haesung DS implements various processes to deliver customized product designs for clients.

Etching

A chemical process that forms shapes through chemical treatments.

Stamping

A physical process that forms shapes using mold tools.

QFP (Quad Flat Package)

• A surface-mounted package with leads extending from all four sides.
• Supports a 110 μm inner lead pitch and exposed pad design.

Unit Design

lnner Lead Pitch 130μm

Power bar/Ground Ring

Locking Tape

Strip Design

Body Size(mm)

5~28

Strip Size(mm)

~100 X 300

Pin Count

32~216

SOIC (Small Outline IC)

• A surface-mounted package with protruding leads extending from two sides
• Supports wide (100 x 300 mm) and high-density designs.

Unit Design

Inter Digit frame
(EX-Lead Sharing)

COL

Multi Pad

Strip Design

Body Size(mm)

3~25

Strip Size(mm)

~100 X 300

Pin Count

6~56

QFN (Quad Flat Non-lead)

• A package attached to the PCB without protruding leads.
• Supports dual land & flip chip configurations and implements a 130 μm wettable flank design

Unit Design

Single Row

Dual Row

Flip Chip

Strip Design

Body Size(mm)

0.6~16

Strip Size(mm)

~100 X 300

Pin Count

4~180

Rt-QFN (Routable QFN)

• A QFN package with a pre-mold application, offering high-design flexibility
• Enables precise pattern implementation and reduction of packaging processes

Unit Design

OFN Type

SiP Module Type

LED Type

Strip Design

Body Size(mm)

2~15

Strip Size(mm)

~78 X 290

Pin Count

~160

Discrete

• A single-function discrete package for high-speed / high-voltage power semiconductors.
• Supports implementation of non-standard raw material shapes and offers dual-side cooling solutions.

Unit Design

TO

TOLL

SOT-227

Strip Design

Body Size(mm)

3~20

Strip Size(mm)

~100 X 300

Pin Count

1~6

Power Module

• A package attached to the PCB without protruding leads.
• Supports dual land & flip chip configurations and implements a 130 μm wettable flank design

Unit Design

Consumer

Automotive

Industry

Strip Design

Body Size(mm)

~100

Strip Size(mm)

~100 X 300

Pin Count

1~6

High-precision punching tool technology

Offers high-design versatility and enhanced wire bonding efficiency.

Fine Punching

QFP : 110μm(Stamp), 150μm(Etch)
QFN : 180μm(Etch)

Precise Tooling

Tol. ±2μm / 1meter

Deep Down-Set Technology

Implements an exposed pad structure that facilitates efficient heat dissipation.

Deep Wettable Flank (130 μm)/h4>

Utilized for automated inspection of solder joints.

Implementation of Stamping Type QFN Configuration

Provides high productivity and cost competitiveness.

Surface Treatment Solution For High Reliability

• Enhances adhesion between EMC mold and lead frame through surface roughening techniques.
• Certified as a high-reliability solution for automotive use, meeting MSL Level 1 and AEC-Q100 Grade 0 standards.

μ-PPF^TM

Passed TCoB with 6,000 cycles.

Forms a strong physical bond between EMC and lead frame through surface roughening treatment.
(Tested on LQFP 176 Pin / Temperature condition: -40~150

Excellent corrosion resistance.

(Test conditions: Exposure to mixed flow gas for over 96 hours)

Technology RoadMap(~2027)