PCB Substrate
Definition
The PCB Substrate is a core component that serves as a platform for mounting memory semiconductor chips, and electrically connecting memory chips to the mainboard.
Processes
Reel-to-Reel
Holds the world’s first and only reel-to-reel stacking process.
Product Types
BOC (Board On Chip)
A package product with the die mounted face-down through a central slot.
Strip Design
Cross Section
Device
FBGA (Fine-pitch Ball Grid Array)
A package product with fine-pitch spacing for solder balls.
Strip Design
Cross Section
Device
Flip Chip FBGA
A package product where the die is mounted using solder balls instead of the wire bonding method.
Strip Design
Cross Section
Device
Multi Layer FBGA
A package product with a structure of three or more layers, connected through each layer by laser vias.
Strip Design
Cross Section
Device
Core Technology
Reel-to-Reel Production Process
First in the world to apply the reel-to-reel continuous production method to PCB substrates.
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High Productivity through Reel-to-Reel Production
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Reel-to-Reel Production Process
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Excellent Alignment through Simultaneous Exposure of Top and Bottom Layers
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Enables the Implementation of Precision Outer Dimensions through Advanced Mold Technology
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Reel-to-Reel Multi Layer PCB Substrate
Delivers uniform lamination pressure and temperature to the material, ensuring consistent mechanical properties in semiconductor PCB substrates.
Technology RoadMap(~2027)
Application
