The tape substrate is a key component for smart cards, applicable to SIM cards, credit cards, and electronic passports.
Reel-to-Reel
Achieves high productivity through a reel-to-reel continuous production process.
Hole Punching
Etching Patterning
Plating
Slitting
Auto-Inspection
Re-Coil
Ensures cost competitiveness and superior quality control with productivity that is more than three times higher than that of competitors.
Delivers uniform lamination pressure and temperature to the material, ensuring consistent mechanical properties in semiconductor PCB substrates.